After the release of the M1 Pro and M1 Max at the MacBook Pro conference in October, Apple is not ready to stop its progress in self-developed chips.
According to a recent report by 9to5Mac, citing The Information, Apple plans to launch second- and third-generation Apple Silicon chips with higher performance in the next few years.
Among them, the second-generation Apple Silicon chip launched in 2022 will use an improved 5nm process, so the improvement in performance (or a single core) and energy efficiency compared to the current M1 series is relatively limited. It is expected that the new generation of MacBook Air will take the lead. use.
However, on some machines with a higher level of performance release, such as desktop Macs, Apple may expand two Die chips based on the existing M1 Pro/M1 Max, essentially forming a dual M1 Max design, so that the Its (multi-core) performance is doubled.
Regarding this point, Bloomberg reporter Mark Gurman also made similar revelations. He said that Apple’s highest-end chips may use four Die designs. So in essence, the recent two generations of Apple Silicon chip designs may be permutations and combinations based on the M1.
Next, Apple plans to launch a 3nm Mac chip manufactured by TSMC as soon as 2023, which is the third-generation Apple Silicon chip, with the internal code names “Ibiza”, “Lobos” and “Palma”. These chips will use up to four Die designs and integrate up to a 40-core CPU.
And it is expected that the A-series chips carried by the iPhone in 2023 will also turn to the 3nm process.
The Links: 3HNA015218-001 3HAC044168-001
